Description
Main Features
- 8 Cores 9th/8th Gen Intel® Xeon®/Core™ i7/i5/i3 (Coffee Lake) with Workstation-grade Intel® C246 chipset
- Fanless, -40°C to 75°C Operating Temperature
- 9 Independent GigE LAN with 4 IEEE 802.3at PoE+
- SIM Sockets for WiFi/4G/3G/LTE/GPRS/UMTS
- 2 2.5″ SSD Tray, 2 SIM Socket, 1 CFast Socket, 2 M.2 Socket
- 6 USB 3.1, 4 COM RS-232/422/485, 16 Isolated DIO
- 6V to 36V DC Power Input with 80V Surge Protection
- Expansion: SUMIT A, B, M.2, up to 5 Mini PCIe
- Configurable Ignition Power Control
- Optional supports multiple 10GigE RJ45/10GigE SFP+/GigE SFP LAN Configuration
ECX-1000-PoER
8 Cores 9th/8th Gen Intel® Xeon/Core™ i7/i5/i3 (Coffee Lake-S) Fanless Embedded System with Intel® C246 Chipset, 6 Independent GigE LAN with 4 IEEE 802.3at PoE+, 2 2.5″ SSD Tray, 16 Isolated DIO, High Performance, Rugged, Extended Temperature.
ECX-1000-PoE
8 Cores 9th/ 8th Gen Intel® Xeon/Core™ i7/i5/i3 (Coffee Lake-S) Fanless Embedded System with Intel® C246 Chipset, 6 Independent GigE LAN with 4 IEEE 802.3at PoE+, 16 Isolated DIO, High Performance, Rugged, Extended Temperature.
ECX-1000-2G
8 Cores 9th/ 8th Gen Intel® Xeon/Core™ i7/i5/i3 (Coffee Lake-S) Fanless Embedded System with Intel® C246 Chipset, 2 Independent GigE LAN, iAMT 12.0 supported, 16 Isolated DIO, High Performance, Rugged, Extended Temperature.
ECX-1000-2R
8 Cores 9th/ 8th Gen Intel® Xeon/Core™ i7/i5/i3 (Coffee Lake-S) Fanless Embedded System with Intel® C246 Chipset, 2 Independent GigE LAN, 2 2.5″ SSD Tray, 16 Isolated DIO, High Performance, Rugged, Extended Temperature.
