HPERC Rugged Finned-convection System with 3rd Gen Intel® Core™ i7 Processor and MIL-STD-38999 High Speed Connectors


Inside the tiny footprint of HPERC™ lives the power of 3rd generation Intel® Core™ i7 processor and optional GPGPU parallel processing engine. Dual removable SSDs provide 12Gb/s throughput and security for deployment in hostile environments. Easy configuration and expansion allows for fast integration of custom rugged embedded applications. HPERC™ reserves connector pins for expansion interfaces. The GPGPU sits on a 16-lane 3rd generation PCI Express interface. Uniquely-keyed MIL-DTL-38999 connectors provide a wide array of fast IO. Built with proven Ampro reliability, the rugged capabilities of HPERC™ are ideal for ground, air and sea deployments. HPERC™ systems survive shock, resist corrosion and galvanic oxidation, and perform in the humid jungle, the heat of the desert, and the bitter cold of frozen mountain passes.

  • High speed eSATA, USB 3.0
  • VITA 75.21 mount with passive cooling
  • Intel® Core™ i7 dual or quad core Processor
  • Soldered DDR3L-1333 8GB, up to 16GB RAM
  • Quad Gigabit Ethernet
  • Available GPGPU on 16-lane 3rd Generation PCI Express
  • Dual independent displays (HDMI/DVI/VGA)
  • Rugged operating temperature: -40°C to +75°C
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